12. Chemical mechanical polishing of plasma-modified Cu/polymer interfaces for advanced hybrid bonding

Last updated on Jul 25, 2025
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Abstract

Advanced Manufacturing Semiconductor Manufacturing Chemical Mechanical Polishing Hybrid Bonding Tribology Surface Engineering Nano scale
Sukkyung Kang
Sukkyung Kang

My research focuses on the phenomena arising from the physical contact between two engineered surfaces. The goal is to develop processing technologies that can create high-value, innovative products by precisely manipulating phenomena such as friction, wear, polishing, diffusion, adhesion, and deformation.