Dishing is a critical defect in chemical mechanical polishing (CMP) that affects the mechanical reliability and electrical performance of hybrid bonding interfaces in semiconductor packaging. This study explores that micro-structured pads with welldefined asperity design can minimize CMP dishing. A theoretical model identifies asperity area, height variation, and modulus as key factors influencing contact pressure and dishing. Experimental results validate the model, demonstrating a 69% reduction in dishing with a soft cylindrical pad compared to a commercial pad. This improvement is attributed to increased real contact area and uniform pressure distribution due to minimized height variation and material compliance.
Sukkyung Kang
My research focuses on the phenomena arising from the physical contact between two engineered surfaces. The goal is to develop processing technologies that can create high-value, innovative products by precisely manipulating phenomena such as friction, wear, polishing, diffusion, adhesion, and deformation.