35. Cu/Polymer CMP Technology for Heterogeneous Semiconductor Integration


Date
Nov 21, 2024 9:00 AM — 6:00 PM
Event
oral presentation in 80th Korea Chemical Mechanical Planarization Users Group Meeting (CMPUGM), Suwon, South Korea, November 2024
Location
Suwon, South Korea
Sukkyung Kang
Sukkyung Kang

My research focuses on the phenomena arising from the physical contact between two engineered surfaces. The goal is to develop processing technologies that can create high-value, innovative products by precisely manipulating phenomena such as friction, wear, polishing, diffusion, adhesion, and deformation.