Sukkyung Kang
Sukkyung Kang
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Semiconductor Manufacturing
11. Mitigation of Cu Dishing in Chemical Mechanical Polishing using Micro-Structured Pads
Seulah Park#,
Sukkyung Kang#
, Dong-Geun Kim#, Sanha Kim,
CIRP Annals - Manufacturing Technology
, 2025, accepted.
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10. Frequency-comb-referenced Terahertz Fabry-Pérot interferometry for monitoring semiconductor wafer thinning process with a nanometer precision
Guseon Kang, Jaeyoon Kim, Jun Hyung Park,
Sukkyung Kang
, Dong Geun Kim, Young Jin Kim,
CIRP Annals - Manufacturing Technology
, 2025, accepted.
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link
9. Characteristics of PVD SiCN for Application in Hybrid Cu Bonding
Junyoung Choi, Suin Jang, Dongmyeong Lee,
Sukkyung Kang
, Sanha Kim, Sarah Eunkyung Kim,
Journal of Semiconductor Technology and Science
, 25, 1, 102, 2025.
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link
8. Nanometer-resolution white-light scanning interferometry for surface-profiling of hybrid bonding samples for advanced semiconductor packaging
Huy Hoang Chu#, Dae Hee Kim#, Jun Hyung Park,
Sukkyung Kang
, Jaiho Son, Hyunmin Lee, Hongki Yoo, Seung-Woo Kim, Sanha Kim, Young-Jin Kim,
Applied Surface Science
, 689, 162466, 2025.
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link
6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition
Chansu Jeon#,
Sukkyung Kang#
, Myeong Eun Kim#, Juseong Park, Daehee Kim, Sanha Kim, Kyung Min Kim,
ACS Applied Materials & Interfaces
, 16, 36, 48481-48487, 2024.
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link
4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices
Juseong Park#,
Sukkyung Kang#
, Myeong Eun Kim, Nam Jun Kim, Jungkyun Kim, Sanha Kim, Kyung Min Kim,
Advanced Materials Technology
, vol. 8, issue 20, 2202134, 2023.
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1. Mechanical abrasion by bi-layered pad micro-asperity in chemical mechanical polishing
Hyun Jun Ryu, Dong Geun Kim,
Sukkyung Kang
, Ji-Hun Jeong and Sanha Kim,
CIRP Annals - Manufacturing Technology
, vol. 70, issue 1, pp 273-276, 2021.
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