Semiconductor Manufacturing

6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

Chansu Jeon#, Sukkyung Kang#, Myeong Eun Kim#, Juseong Park, Daehee Kim, Sanha Kim, Kyung Min Kim, ACS Applied Materials & Interfaces, 16, 36, 48481-48487, 2024.

6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices

Juseong Park#, Sukkyung Kang#, Myeong Eun Kim, Nam Jun Kim, Jungkyun Kim, Sanha Kim, Kyung Min Kim, Advanced Materials Technology, vol. 8, issue 20, 2202134, 2023.

4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices

1. Mechanical abrasion by bi-layered pad micro-asperity in chemical mechanical polishing

Hyun Jun Ryu, Dong Geun Kim, Sukkyung Kang, Ji-Hun Jeong and Sanha Kim, CIRP Annals - Manufacturing Technology, vol. 70, issue 1, pp 273-276, 2021.

1. Mechanical abrasion by bi-layered pad micro-asperity in chemical mechanical polishing