Hybrid Bonding

6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition
Chansu Jeon#, Sukkyung Kang#, Myeong Eun Kim#, Juseong Park, Daehee Kim, Sanha Kim, Kyung Min Kim, ACS Applied Materials & Interfaces, 16, 36, 48481-48487, 2024.
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6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition
4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices
Juseong Park#, Sukkyung Kang#, Myeong Eun Kim, Nam Jun Kim, Jungkyun Kim, Sanha Kim, Kyung Min Kim, Advanced Materials Technology, vol. 8, issue 20, 2202134, 2023.
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4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices