Hybrid Bonding

15. Effects of grain size on bonding performance of Cu-to-Cu bonding

Hyun-Dong Lee#, Sukkyung Kang#, Yeo-Jin Kim, Eun-Ho Lee, Sung-Ho Park, Won-Seob Cho, Yong-Jin Park, Alexandra Haag, Soichi Watanabe, Marco Arnold, Sanha Kim, Hoo-Jeong Lee, Journal of Materials Research and Technology, 36, 8965-8974, 2025.

15. Effects of grain size on bonding performance of Cu-to-Cu bonding

14. Chemical mechanical polishing of plasma-modified Cu/polymer interfaces for advanced hybrid bonding

Sukkyung Kang#, Chansu Jeon#, Juseong Park, Seulah Park, Kyung Min Kim, Sanha Kim, Advanced Science, 13, 3, e12611, 2025.

14. Chemical mechanical polishing of plasma-modified Cu/polymer interfaces for advanced hybrid bonding

12. Modeling framework and discussion of microstructural effects on the formation of Cu–Cu bonding interfaces in semiconductor stacking

Jae-Uk Lee, Hyun-Dong Lee, Sung-Hyun Oh, Young-Dae Shim, Sukkyung Kang, Sanha Kim, Hoo-Jeong Lee, Eun-Ho Lee, International Journal of Plasticity, 195, 104501, 2025.

12. Modeling framework and discussion of microstructural effects on the formation of Cu–Cu bonding interfaces in semiconductor stacking

11. Frequency-comb-referenced Terahertz Fabry-Pérot interferometry for monitoring semiconductor wafer thinning process with a nanometer precision

Guseon Kang, Jaeyoon Kim, Jun Hyung Park, Sukkyung Kang, Dong Geun Kim, Young Jin Kim, CIRP Annals - Manufacturing Technology, 74, 1, 679-683, 2025.

11. Frequency-comb-referenced Terahertz Fabry-Pérot interferometry for monitoring semiconductor wafer thinning process with a nanometer precision

10. Mitigation of Cu Dishing in Chemical Mechanical Polishing using Micro-Structured Pads

Seulah Park#, Sukkyung Kang#, Dong-Geun Kim#, Sanha Kim, CIRP Annals - Manufacturing Technology, 74, 1, 465-469, 2025.

10. Mitigation of Cu Dishing in Chemical Mechanical Polishing using Micro-Structured Pads

9. Characteristics of PVD SiCN for Application in Hybrid Cu Bonding

Junyoung Choi, Suin Jang, Dongmyeong Lee, Sukkyung Kang, Sanha Kim, Sarah Eunkyung Kim, Journal of Semiconductor Technology and Science, 25, 1, 102, 2025.

9. Characteristics of PVD SiCN for Application in Hybrid Cu Bonding

8. Nanometer-resolution white-light scanning interferometry for surface-profiling of hybrid bonding samples for advanced semiconductor packaging

Huy Hoang Chu#, Dae Hee Kim#, Jun Hyung Park, Sukkyung Kang, Jaiho Son, Hyunmin Lee, Hongki Yoo, Seung-Woo Kim, Sanha Kim, Young-Jin Kim, Applied Surface Science, 689, 162466, 2025.

8. Nanometer-resolution white-light scanning interferometry for surface-profiling of hybrid bonding samples for advanced semiconductor packaging

6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

Chansu Jeon#, Sukkyung Kang#, Myeong Eun Kim#, Juseong Park, Daehee Kim, Sanha Kim, Kyung Min Kim, ACS Applied Materials & Interfaces, 16, 36, 48481-48487, 2024.

6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices

Juseong Park#, Sukkyung Kang#, Myeong Eun Kim, Nam Jun Kim, Jungkyun Kim, Sanha Kim, Kyung Min Kim, Advanced Materials Technology, 8, 20, 2202134, 2023.

4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices