Chemical Mechanical Polishing

11. Mitigation of Cu Dishing in Chemical Mechanical Polishing using Micro-Structured Pads

Seulah Park#, Sukkyung Kang#, Dong-Geun Kim#, Sanha Kim, CIRP Annals - Manufacturing Technology, 2025, accepted.

11. Mitigation of Cu Dishing in Chemical Mechanical Polishing using Micro-Structured Pads

9. Characteristics of PVD SiCN for Application in Hybrid Cu Bonding

Junyoung Choi, Suin Jang, Dongmyeong Lee, Sukkyung Kang, Sanha Kim, Sarah Eunkyung Kim, Journal of Semiconductor Technology and Science, 25, 1, 102, 2025.

9. Characteristics of PVD SiCN for Application in Hybrid Cu Bonding

4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices

Juseong Park#, Sukkyung Kang#, Myeong Eun Kim, Nam Jun Kim, Jungkyun Kim, Sanha Kim, Kyung Min Kim, Advanced Materials Technology, vol. 8, issue 20, 2202134, 2023.

4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices

1. Mechanical abrasion by bi-layered pad micro-asperity in chemical mechanical polishing

Hyun Jun Ryu, Dong Geun Kim, Sukkyung Kang, Ji-Hun Jeong and Sanha Kim, CIRP Annals - Manufacturing Technology, vol. 70, issue 1, pp 273-276, 2021.

1. Mechanical abrasion by bi-layered pad micro-asperity in chemical mechanical polishing